The characteristics of manufacturing process of integrated circuit chip

The manufacturing process of integrated circuit chips involves a wide range of materials, including metals, semiconductors, chemicals, gases, and water. The selection and use of these materials are crucial to ensuring the performance and stability of the chips.

Moreover, the processing technology is extremely intricate and complex. The entire manufacturing process can be roughly divided into three main parts: isolation technology, planar technology, and post-processing technology. Isolation technology mainly includes dielectric isolation, p-n junction isolation, and air isolation methods, which require the use of oxidation, photolithography, epitaxy, diffusion, and other processes. Planar technology, which is the core of integrated circuit manufacturing, covers key steps such as epitaxy, oxidation, photolithography, diffusion, and evaporation. Post-processing technology, on the other hand, involves slicing, cutting, sintering, welding, packaging, process screening, testing, classification, and printing, ensuring the final quality and performance of the chips.